Molex QSFP-DD BiPass Thermal Cooling Configuration Provides Next- Generation Solutions

BiPass solution highlights 20W cooling abilities to help designers on
the path toward future innovation

LISLE, Ill.–(BUSINESS WIRE)–Molex,
a global electronic solutions provider, highlights its new BiPass
thermal management configuration cooling QSFP-DD
modules up to 20W with a 15 degree Celsius change from the ambient
temperature. First shown at DesignCon 2019, the Molex QSFP-DD
thermal solution can cool a range of 15W to 20W in different
configurations. The BiPass solution allows higher wattage modules to be
cooled and will help designers on the path toward 112 Gbps.

As the industry is readying for the launch of next-generation copper and
optical QSFP-DD transceivers, thermal management strategies are
critical. During the demonstration, Molex showcased a QSFP-DD
belly-to-belly BiPass configuration, QSFP-DD belly-to-belly SMT
configuration, 2×1 QSFP-DD stacked configuration and 1×2 QFSP-DD BiPass
in a vertical orientation with dual heat sinks. Running at 15W, all
configurations were able to cool at less than 25 degree Celsius delta T
rise. The BiPass solution routes high-speed signals through Temp-Flex
twinax cables enabling greater channel margin compared to PCB alone and
allows for a second heat sink on the bottom side of the cage to make
contact with the module, providing additional cooling.

“If you need to be able to cool a 15W module, there are a number of
different solutions available today,” said Chris Kapuscinski, global
product manager, Molex. “We now have the ability to cool higher wattage
modules. The BiPass solution has the opportunity to save designers money
as well as be a key enabler as we move forward with 112 Gbps PAM-4
implementations.”

The BiPass solution, allows designers to bypass the lossy printed
circuit board by utilizing Temp-Flex high-speed twinax. Because of this,
they can achieve lower insertion loss when going from an ASIC in a
switch or a router to another server within a rack. Advances in heat
sink technologies are enabling highly efficient, reliable and resilient
thermal management strategies to support higher density in both copper
and optical connectivity. From a future perspective, this great signal
integrity performance and low insertion loss capability allows designers
to use passive copper throughout the entire design.

“As demand for faster data rates grow, data center technology is
evolving quickly, and thermal management technology must keep up. The
BiPass solution allows for better temperature control of a system using
advanced materials, the latest tools and cutting-edge technologies
without compromising performance,” adds Kapuscinski.

To learn more about Molex thermal capabilities and solutions for data
centers, visit http://www.molex.com/capabilities/thermalm.html.

About Molex:

Molex brings together innovation and technology to deliver electronic
solutions to customers worldwide. With a presence in more than 40
countries, Molex offers a full suite of solutions and services for many
markets, including data communications, consumer electronics, medical,
industrial, automotive, and commercial vehicle. For more information,
please visit www.molex.com.

Molex Resources:

Molex is a registered trademark of Molex, LLC in the United States of
America and may be registered in other countries; all other trademarks
listed herein belong to their respective owners.

Contacts

FOR EDITORIAL INFORMATION:
Molex
Christa Carroll
Senior
Vice President
Outlook Marketing Services
630.408.9164
Christa@outlookmarketingsrv.com

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